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MADS-002545-1307 Series
SURMOUNTTM Schottky Diodes: Cross-Over Quad Series Ultra-Small 600x600um Surface-Mount Chip
Features
* Ultra Low Parasitic Capacitance and Inductance * Surface Mountable in Microwave Circuits , No Wire bonds Required * Rugged HMIC Construction with Polyimide Scratch Protection * Reliable, Multilayer Metallization with a Diffusion * Barrier, 100% Stabilization Bake (300 C, 16 hours) * Lower Susceptibility to ESD Damage Topview
M/A-COM Products
Rev. V3
A
B
Description and Applications
The MADS-002545-1307 Series Surmount Silicon Schottky Cross-Over Quad Diodes are fabricated with the patented Heterolithic Microwave Integrated Circuit (HMIC) process. HMIC circuits consist of Silicon pedestals which form diodes or via conductors embedded in a glass dielectric, which acts as the low dispersion, low loss, microstrip transmission medium. The combination of silicon and glass allows HMIC devices to have excellent loss and power dissipation characteristics in a low profile, reliable device. These Surmount Schottky devices are excellent choices for circuits requiring the small parasitics of a beam lead device coupled with the superior mechanical performance of a chip. The Surmount structure employs very low resistance silicon vias to connect the Schottky contacts to the metalized mounting pads on the bottom surface of the chip. These devices are reliable, repeatable, and a lower cost performance solution to conventional devices. They have lower susceptibility to electrostatic discharge than conventional beam lead Schottky diodes. The multi-layer metallization employed in the fabrication of the Surmount Schottky junctions includes a platinum diffusion barrier, which permits all devices to be subjected to a 16hour non-operating stabilization bake at 300C. The " 0202 " outline allows for Surface Mount placement and multi- functional polarity orientations. The MADS-002545-1307 Series is recommended for use in microwave circuits through Ku band frequencies for lower power applications such as mixers, sub-harmonic mixers, detectors and limiters. The HMIC construction facilitates the direct replacement of more fragile beam lead diodes with the corresponding Surmount diode, which can be connected to a hard or soft substrate circuit with solder.
C D E
Sideview
D
Case Style 1307
MADS-002545-1307 Equivalent Circuit
Dim Min.
A B C D Sq. E Sq.
Inches Max.
0.025 0.025 0.008 0.009 0.009 0.023 0.023 0.004 0.007 0.007
Millimeters Min. Max.
0.575 0.575 0.102 0.175 0.175 0.625 0.625 0.203 0.225 0.225
1
* North America Tel: 800.366.2266 / Fax: 978.366.2266 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.
MADS-002545-1307 Series
SURMOUNTTM Schottky Diodes: Cross-Over Quad Series Ultra-Small 600x600um Surface-Mount Chip
Electrical Specifications @ + 25 C (Measured as Single Diodes)
Model Number
MADS-002545-1307L MADS-002545-1307M MADS-002545-1307H
M/A-COM Products
Rev. V3
Type
Low Barrier Medium Barrier High Barrier
Recommended Frequency Range
DC - 18 GHz DC - 18 GHz DC - 18 GHz
Vf @ 1 mA ( mV )
330 Max 305 Typ 470 Max 390 Typ 700 Max 650 Typ
Vf @ 1mA ( mV )
10 Max 10 Max 10 Max
Ct @ 0V ( pF )
0.22 Max 0.11 Typ 0.22 Max 0.11 Typ 0.22 Max 0.11 Typ
Rt Slope Resistance ( Vf1-Vf2 ) / ( 10.5mA - 9.5mA ) ()
11 Typical 20 Max 10 Typical 18 Max 9 Typical 15 Max
Rt is the dynamic slope resistance where Rt = Rs + Rj where Rj =26 / Idc ( Idc is in mA ) and Rs is the Ohmic Resistance.
Absolute Maximum Ratings @ 25 C 1 Handling Procedures
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. The top surface of the die has a protective polyimide coating to minimize damage. The rugged construction of these Surmount devices allows the use of standard handling and die attach techniques. It is important to note that industry standard electrostatic discharge (ESD) control is required at all times, due to the sensitive nature of Schottky junctions. Bulk handling should insure that abrasion and mechanical shock are minimized.
Parameter
Operating Temperature Storage Temperature Junction Temperature Die Bonding Temperature Forward Current Reverse Voltage l - 10 A l RF C.W. Incident Power RF & DC Dissipated Power
Absolute Maximum
-40 C to +125 C -40 C to +150 C +175 C +320 C for 10 sec. 20 mA I -5 V I +20 dBm C.W. 50 mW
Die Bonding
Die attach for these devices is made simple through the use of surface mount die attach technology. Mounting pads are conveniently located on the bottom surface of these devices, and are opposite the active junction. The devices are well suited for high temperature solder attachment onto hard substrates. 80Au/20Sn and Sn63/Pb36 solders are acceptable for usage.
1. Operation of this device above any one of these parameters may cause permanent damage.
Die Bonding
For Hard substrates, we recommend utilizing a vacuum tip and force of 60 to 100 grams applied uniformly to the top surface of the device, using a hot gas bonder with equal heat applied across the bottom mounting pads of the device. When soldering to soft substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so that its mounting pads are aligned with the circuit board mounting pads. Reflow the solder paste by applying Equal heat to the circuit at both die-mounting pads. The solder joint must Not be made one at a time, creating un-equal heat flow and thermal stress. Solder reflow should Not be performed by causing heat to flow through the top surface of the die. Since the HMIC glass is transparent, the edges of the mounting pads can be visually inspected through the die after die attach is completed.
2
* North America Tel: 800.366.2266 / Fax: 978.366.2266 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.
MADS-002545-1307 Series
SURMOUNTTM Schottky Diodes: Cross-Over Quad Series Ultra-Small 600x600um Surface-Mount Chip
Circuit Mounting Dimensions ( Inches )
0.012 0.012
M/A-COM Products
Rev. V3
0.012
0.012
0.009 0.009
0.012
0.012
Ordering Information
Part Number
MADS-002545-1307LG MADS-002545-1307LT MADS-002545-1307MG MADS-002545-1307MT MADS-002545-1307HG MADS-002545-1307HT
Package
Die in Carrier Tape/Reel Die in Carrier Tape/Reel Die in Carrier Tape/Reel
3
* North America Tel: 800.366.2266 / Fax: 978.366.2266 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.

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